Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
The Providence Journal

ANSYS/Apache and TSMC Collaborate on 16-nanometer FinFET Reference Flow and 3D-IC Reference Flow

PITTSBURGH, Sept. 26, 2013 /PRNewswire/ -- ANSYS subsidiary Apache Design announced today that its RedHawk(TM) and Totem(TM) products have completed methodology innovations to be included in TSMC's ...
KRQE Blogs

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks Ansys ...
insideHPC

ANSYS® FLUENT® ON MICROSOFT® AZURE® HBv3 VIRTUAL MACHINES FEATURING AMD 3D V-CACHE™ TECHNOLOGY

COMPUTATIONAL FLUID DYNAMICS AMD EPYC™7003 Series Processors with AMD 3D V-Cache deliver outstanding scale-out performance running Ansys® Fluent® on Microsoft® Azure® HBv3 virtual machines. This ...
Finanznachrichten

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Additionally, TSMC, Ansys, and Synopsys continue their long-standing collaboration to ensure the best technical solutions for their customers. Together, the companies developed an innovative ...