An Asian foundry capable of SOI BiCMOS production and a crack mixed signal design team are behind the second generation of Bluetooth ICs that Silicon Wave Inc. is expanding by two more parts today.

Taiwan Semiconductor Manufacturing Company (TSMC) announced on March 1 the availability of 0.35-micron BiCMOS (bipolar-complementary metal oxide semiconductor) process technology to its customers.

As general purpose components, logic devices are used at different frequencies and power supply voltages in many different varieties of applications. This large diversity has produced the need to ...

In an effort to gain a competitive edge in the cost-sensitive wireless communications arena, STMicroelectronics has added silicon-germanium (SiGe) biCMOS to its arsenal of process technologies. The ...

New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects. Developing a roadmap with partners across ...

With the exponential growth of AI computing needs, issues have grown around the performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is ...

Scientists from imec’s IDLab demonstrated a 120-Gbaud transmitter IC that implements a SiGe BiCMOS multiplexer, equalizer, and driver. The architecture significantly increases baud rate and has a high ...

ESI-1002 enables SFP+ modules with sub-1 watt power consumption Overall SFP+ module shipment per year expected to be $2.5B; total revenue for chipmakers approximately $300M per year NEWPORT BEACH, ...

STMicroelectronics today released details of the company’s silicon germanium(SiGe) bipolar-CMOS (BiCMOS) chip manufacturing process for both existing and ...

Analog Devices’ modular BiCMOS process, developed at its Limerick design centre, will be used for industrial and automotive chips . Called iCMOS, for industrial CMOS, “what we have really done is take ...