Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...

Increasing device complexity and the continuing drive for higher levels of quality are fostering a reconsideration of test strategies. To be effective, test engineers must choose how to optimally ...

IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors, which will ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

The high-frequency Center Probe and CSP/MicroBGA test and burn-in sockets are now offered in sizes up to 6.5-mm2 with pitches down to 0.3 mm to enable the testing of smaller components. The sockets ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.