IEEE Spectrum on MSN
The ultimate 3D integration would cook future GPUs
D stacking doubles the operating temperature inside the GPU, rendering it inoperable. But the team, led by Imec’s James Myers ...
SEOUL (Reuters) -Samsung Electronics said on Friday it is in “close discussion” to supply its next-generation high-bandwidth memory (HBM) chips, or HBM4, to Nvidia, as the South Korean chipmaker ...
TL;DR: NVIDIA and Meta are collaborating with SK hynix and Samsung to integrate GPU cores directly into the HBM base die, aiming to enhance AI GPU performance and energy efficiency by reducing data ...
Micron Technology, Inc. MU is making a major push in the artificial intelligence (AI) memory space with its upcoming customizable high-bandwidth memory (HBM) chips, HBM4E. Following a record-breaking ...
A special section aims to untangle AI’s major building blocks while providing a peek into this industry’s evolving design ...
Memory chip manufacturer Micron (NASDAQ: MU) was slow to embrace the high-bandwidth memory (HBM) chip market. HBM is critical for artificial intelligence accelerators, providing the massive bandwidth ...
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