Samsung shows confidence in HBM, portrays next-gen road map

Samsung Electronics Chief Technology Officer Song Jai-hyuk said Wednesday the company’s high-bandwidth memory 4 (HBM4) chip is showing “good” ...
TweakTown

Future of next-gen HBM: HBM4, HBM5, HBM6, HBM7, and HBM8 teased with 15,000W AI GPUs by 2038

TL;DR: Next-generation HBM memory standards from HBM4 to HBM8 promise significant advances in AI GPU performance, with NVIDIA and AMD leading adoption. HBM4 launches in 2026, offering up to 384GB ...
TweakTown

The next-gen HBM chips will combine both GPU and HBM for future AI chips from Meta and NVIDIA

TL;DR: NVIDIA and Meta are collaborating with SK hynix and Samsung to integrate GPU cores directly into the HBM base die, aiming to enhance AI GPU performance and energy efficiency by reducing data ...
Hosted on MSN

Samsung, SK hynix move toward hybrid bonding for next-gen HBM

Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory (HBM), a move expected to reshape the global semiconductor equipment ...
Semiconductor Engineering

High Bandwidth Memory (HBM): Everything You Need To Know

In an era where data-intensive applications, from AI and machine learning to high-performance computing (HPC) and gaming, are pushing the limits of traditional memory architectures, High Bandwidth ...
Semiconductor Engineering

HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)

A new technical paper titled “HBM Roadmap Ver 1.7 Workshop” was published by researchers at KAIST’s TERALAB. The 371-page paper provides an overview of next-generation HBM architectures based on ...