As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...
-- Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. -- The study allows to identify and mitigate thermal ...
TL;DR: Broadcom has introduced its 3.5D eXtreme Dimension System in Package (XDSiP) technology, enabling AI customers to develop advanced custom accelerators. This platform integrates over 6000 mm² of ...
Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures Imec ...
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