Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both ...

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

CHARLOTTE, N.C. — Chip testing strategies continue to perplex the industry as sub-100 nm node designs become more commonplace. The debate came into focus at this year's International Test Conference ...

Recent and continuing trends in the semiconductor industry pose challenges to IC test-data volumes, test application times, and test costs. The industry has thus far succeeded in containing test costs ...

Among the first decisions to be made when initiating a composites testing program is the selection of test methods to follow. Unless performing highly customized testing, it’s usually not difficult to ...