IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
SIEGEN, Germany & LAS VEGAS--(BUSINESS WIRE)--On schedule with CES 2020, pmdtechnologies is presenting its latest 3D Time-of-Flight camera module, based on the 5th generation REAL3™ ToF image sensor ...
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