An agreement to secure supply for Qualcomm Technologies’ new generation of RF filters After multiple years of collaboration with Qualcomm Technologies, Soitec has concluded an agreement to bring POI ...

LOS GATOS, CA / ACCESSWIRE / July 2, 2024 / Atomera Incorporated (NASDAQ:ATOM), a semiconductor materials and technology licensing company, today announced the availability of an MST® solution to ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Bernin (France), December 4 th, 2024 — Soitec, a leader in the design and manufacture of innovative semiconductor materials, announced today its commitment to deliver 300mm RF-SOI substrates to ...

IXYS Colorado announced its new series, the IXZ631, an integrated high-speed gate driver and MOSFET RF modules featuring very low insertion inductance and isolated substrate. The product is designed ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...

Bernin (Grenoble), France, July 7th, 2020 - Soitec (Euronext Paris), an industry leader in designing and manufacturing innovative semiconductor materials, announced today a business agreement with ...