Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging ...

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park. The ...

BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a national high-tech ...

ATLANTA--(BUSINESS WIRE)--Sustainable packaging leader DS Smith, bolstering its commitment to accelerate its work in the circular economy, announced today a $140 million investment in research and ...

BASEL, Switzerland--(BUSINESS WIRE)--Bayer has launched a first-of-its-kind in the healthcare industry, polyethylene terephthalate (PET) blister packaging on its renowned brand, Aleve. Realized in ...

Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...