Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Packaging often stands as the first physical point of contact between a brand and its audience. While often overlooked or treated as an afterthought, package design reflects a brand’s attention to ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.