ESCONDIDO, Calif., March 16, 2023 (GLOBE NEWSWIRE) -- QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad ...
Analog Devices is introducing the industry’s first quad-channel PMU (parametric measurement unit). The AD5522 combines four independent channels in a space-saving 12 mm ¥ 12 mm TQFP package. Each of ...
Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is ...
The high performance SG-QFE-7007 socket supports 144-pin, 0.4-mm pitch TQFP packages measuring 16 mm x 16 mm x 1.2 mm with an 18 mm x 18 mm lead tip to tip. The component operates at bandwidths up to ...
CHANDLER, Ariz. — Amkor Technology Inc. has expanded its series of low-profile quad flat pack (LQFP) packages for ICs requiring higher electrical performance and enhanced thermal characteristics ...
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