Second-generation SPARK chip delivers 100X lower power ranging than UWB competitors; extends leadership in high data rates, power efficiency, latency and signal robustness MONTREAL, April 22, ...

MUNICH, Germany — Infineon Technologies AG has finalized the tapeout of a dual-band ultrawideband (UWB) transceiver that it claims will beef up mobile devices for broadband communications. Infineon's ...

SPARK’s SR1120 LE-UWB™ transceiver recognized for outstanding design and engineering among embedded technologies enabling consumer technology products SPARK’s award-winning innovation will be ...

German chip maker Infineon Technologies AG has designed a core transceiver for a new generation of system-on-chip semiconductors that will allow consumer electronic devices, such as mobile phones and ...

Munich, Germany, July 19, 2006-- Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication chips, today announced successful tape-out of a dual-band UWB (Ultra-Wideband) Radio ...

Following the completion of its internal field tests, Alcor Micro said its ultra wideband (UWB) radio frequency (RF) transceiver will be ready for mass production in the fourth quarter of this year.

Second-generation SPARK chip delivers 100X lower power ranging than UWB competitors; extends leadership in high data rates, power efficiency, latency and signal robustness SPARK Microsystems, a ...

Infineon has finalized the tape-out of a dual-band UWB transceiver. With the design, the company hopes to open the way to enable mobile devices for broadband communications. Infineon's low power CMOS ...

SPARK’s SR1120 LE-UWB™ transceiver recognized for outstanding design and engineering among embedded technologies enabling consumer technology products SPARK Microsystems, a Canadian fabless ...