No longer just for on-board dc distribution to point-of-load, this maverick architecture promises higher efficiency from the mains to the load. FPA is a response to the limitations of conventional ...
Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
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