IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
TAINAN, Taiwan, Dec. 23, 2024 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (HIMX), an industry leader in fabless display driver ICs and other semiconductors, today announced that the Company and its ...
Interview: GCL to focus on system integration solutions, more than a high efficiency module provider
At this year’s 2021 SNEC Expo, GCL System Integration, a part of the Golden Concord Group (hereinafter referred to as GCL), launched a series of new module products which echoed the horn of the ...
TORRINGTON, Conn., Nov. 14, 2023 /PRNewswire/ -- Therap Services, the national provider of person-centered electronic documentation for agencies and caregivers in Home and Community-Based Services ...
Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, ...
Quectel Announces Industry First 5G-Advanced 3GPP R18 Automotive-Grade Cellular Module, Delivering Unmatched Performance and ReliabilityBusiness Wire via ITWeb,LAS VEGAS, 02 Jan 2026Quectel Wireless ...
The new X5-210M module from Innovative Integration is an XMC IO module featuring four 14-bit 210 MSPS A/Ds with a Virtex5 FPGA computing core, DRAM and SRAM memory, and eight lane PCI Express host ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback