Boston, Jan. 06, 2026 (GLOBE NEWSWIRE) -- According to the latest study from BCC Research, “Global Semiconductor Silicon Wafer Market” is projected to grow from $14.6 billion in 2025 to $20.2 billion ...
Initially stacked benzene layers increase fluorescent color change drastically when exposed to pressure, suggesting new ways to design the pressure sensors used in machinery and medical devices.
A new instrument under development at the National Institute of Standards and Technology (NIST) uses infrared laser light to precisely measure the thickness of 300 millimeter silicon wafers. NIST ...
Welcome to the Department of Physics and Astronomy at the University of Delaware, where the pursuit of scientific discovery and innovation meets cutting-edge research and academic excellence. Our ...
Greg McFarlane is a financial writer and co-founder of ControlYourCash.com. He is also the co-author of Control Your Cash: Making Money Make Sense. David Kindness is a Certified Public Accountant (CPA ...
Abstract: In this work, a 300 mm wafer with Cu pads of 1 μm x 1 μm is used for a hybrid bonding process research. The Cu/SiO 2 layers were planarized by a three-platen CMP process using different ...
Abstract: Wafer-to-wafer hybrid bonding technology is a key enabler to achieve fine-pitch 3D integration, allowing shorter electrical paths, lowest signal loss, higher performances, and increased ...