Mouser Electronics is now stocking the PIC32WM-BZ6 multiprotocol module from Microchip Technology. The PIC32WM-BZ6 is a highly integrated ...

Rivian announced an autonomy subscription offering, Autonomy+, due to launch in early 2026. Credit: T. Schneider/Shutterstock.com. US automotive company Rivian is advancing its vertically integrated ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by ...

*Multi-Chip-Module (MCM) - where the NVM die would be placed in the same plastic package as the controller Each of these configurations would have its pros and cons. The embedded NVM would be the most ...

After a wicked sell-off in April, the major indices have clawed back much of the downside. Many on Wall Street feel tariff resolutions could give the stock market a significant boost. Patient ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s ...

Sarcina’s work in photonic package design is enabling a new era of high data rate, high bandwidth, and low power interconnects. Traditional copper interconnects can no longer meet the performance, ...

A new technical paper titled “MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia Tech. “Increasing AI computing ...

ESD industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in ...