SHENZHEN, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- The global fragrance and home décor market has seen ...

Company also named a Packaging Finalist for the IT Award at MakeUp in LA for Pure Needle Nose Airtight Tube DALLAS, TX, ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

Husky Technologies introduces Hylectric and HyperSync molding platforms designed for sustainable packaging production ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Go Industries Inc, a Texas-based manufacturer with over four decades of experience, announces the expansion of its custom manufacturing and fabrication services to meet growing demand from original ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.

Microsoft Publisher is retiring—but your designs can level up. Whether you want something familiar, beginner-friendly, or ...

Laser engraving has evolved from a niche industrial technique into one of the most versatile and efficient technologies used by businesses today. Whether for manufacturing, design or personalisation, ...

Topfeel’s Design-Driven Culture of Innovation Topfeel’s unique engineering-led system is at the core of its capabilities. Each of the company’s experts has over 10 years experience in the industry and ...

Driving Innovation and Sustainability in the Sanitary Napkin Market with Advanced Manufacturing Solutions CALIFORNIA, ...